Mold-Tek Announces 1:1 Bonus Issue, ₹2 Final Dividend, and AGM on Sep 21
Mold-Tek Technologies approved a 1:1 bonus share issue and recommended a ₹2 final dividend per equity share. The 42nd AGM is scheduled for September 21, 2026, with a record date of September 14, 2026, for dividend entitlement. Book closure is from September 15-21, 2026.
A bonus issue and dividend declaration are significant corporate actions that directly impact shareholder value and can influence investor sentiment.
The announcement of a bonus issue and a final dividend is generally viewed positively by investors as it rewards shareholders.
Mold-Tek Technologies Limited announced a significant outcome from its Board Meeting held on August 26, 2026. The Board approved a bonus equity share issuance in a 1:1 ratio, meaning one bonus share of ₹2 face value for every one equity share of ₹2 held, subject to shareholder approval. The company will announce the record date for this bonus issue in due course.
Additionally, the Board recommended a final dividend of ₹2.00 per equity share for the financial year ending March 31, 2026. This dividend is subject to the approval of the company's members at the upcoming Annual General Meeting (AGM). The record date for determining entitlement to this dividend has been fixed as September 14, 2026.
The 42nd AGM of the company is scheduled to be held on Monday, September 21, 2026, through video conference. To facilitate the AGM and the final dividend distribution, the Register of Members and Share Transfer Books will be closed from September 15, 2026, to September 21, 2026, inclusive.
The bonus issue will involve the issuance of approximately 2,88,05,118 equity shares, amounting to ₹5,76,10,236. These shares will be issued out of the company's free reserves and securities premium, which stood at ₹1,15,00,36,940 as of March 31, 2026. The company estimates the bonus issue will be implemented within two months from the board meeting date. The board meeting commenced at 1:30 PM IST and concluded at 2:55 PM IST.
A plain-language summary of a public exchange filing by Mold-Tek Technologies Limited. Read the original for the full detail.