Mold-Tek Announces 1:1 Bonus Issue and ₹2 Final Dividend

Mold-Tek Technologies Limited announced a significant corporate action following its Board Meeting held on August 26, 2026. The Board approved the issuance of bonus equity shares in a 1:1 ratio, meaning one new equity share of ₹2 each will be issued for every one fully paid-up equity share of ₹2 held, subject to shareholder approval. The company will announce the record date for this bonus issue in due course.

Additionally, the Board recommended a final dividend of ₹2.00 per equity share for the financial year ending March 31, 2026. This dividend is subject to the approval of the company's members at the upcoming Annual General Meeting (AGM), scheduled for September 21, 2026. The record date for determining entitlement to this dividend has been fixed as September 14, 2026. The company also approved the convening of its 42nd AGM on September 21, 2026, to be conducted through video conference or other audio-visual means.

To facilitate the AGM and dividend distribution, the Register of Members and Share Transfer Books will be closed from September 15, 2026, to September 21, 2026, inclusive. The bonus issue, amounting to ₹5,76,10,236 (approximately 2,88,05,118 equity shares), will be funded from the company's free reserves and will be implemented within two months from the Board Meeting date. The company's paid-up share capital will increase from ₹5,76,10,236 to ₹11,52,20,472 post the bonus issue.