Mold-Tek Technologies Recommends ₹2 Dividend, Announces 1:1 Bonus Share Issue
Mold-Tek Technologies recommended a final dividend of ₹2 per share and approved a 1:1 bonus share issue. The 42nd AGM is scheduled for September 21, 2026. The record date for dividend entitlement is September 14, 2026. The bonus issue, valued at ₹5.76 crore, will be implemented within two months.
A bonus issue and a dividend are significant corporate actions that directly benefit shareholders and can positively influence stock price and investor sentiment.
The announcement of a dividend and a bonus issue is generally positive for shareholders, indicating the company's financial health and willingness to reward investors.
Mold-Tek Technologies Limited announced the outcome of its Board Meeting held on August 26, 2026. The Board recommended a final dividend of ₹2.00 per equity share for the financial year ending March 31, 2026. This dividend is subject to shareholder approval at the upcoming Annual General Meeting (AGM) scheduled for September 21, 2026.
The Board also approved the issuance of bonus equity shares in a 1:1 ratio, meaning one bonus share of ₹2 face value will be issued for every one fully paid-up equity share of ₹2 held, subject to shareholder approval. The company will announce the record date for both the bonus issue and dividend entitlement in due course. The bonus issue is to be implemented within two months from the Board meeting date.
The 42nd AGM of the Company will be held on Monday, September 21, 2026, through video conference. The Register of Members and Share Transfer Books will be closed from September 15, 2026, to September 21, 2026, inclusive, for the AGM and dividend entitlement purposes. The record date for determining dividend entitlement is September 14, 2026. The bonus issue will utilize ₹5,76,10,236/- from the company's free reserves as of March 31, 2026, which stood at ₹1,15,00,36,940/-.
A plain-language summary of a public exchange filing by Mold-Tek Technologies Limited. Read the original for the full detail.