Mold-Tek Packaging to hold 29th AGM on Sep 21, 2026; proposes 1:1 bonus issue & ₹5 dividend
Mold-Tek Packaging Limited will hold its 29th AGM on September 21, 2026. The company proposes a final dividend of ₹3 per share, bringing the total for FY26 to ₹5, and a 1:1 bonus share issue. E-voting will be open from September 17 to September 20, 2026.
The proposed bonus issue and dividend payout are material financial events that can significantly impact investor sentiment and the company's stock performance.
The announcement includes a proposed bonus issue and a significant dividend payout, which are generally viewed positively by investors.
Mold-Tek Packaging Limited has announced that its 29th Annual General Meeting (AGM) will be held on Monday, September 21, 2026, at 10:00 AM IST, through Video Conferencing (VC) / Other Audio Visual Means (OAVM). The company will submit its Annual Report for the Financial Year 2025-26, which includes the Notice convening the AGM.
The Annual Report will be sent to members via electronic mode and is also uploaded on the company's website. The e-voting facility will be available to all members, with the cut-off date for e-voting set for Monday, September 14, 2026. Remote e-voting will commence on Thursday, September 17, 2026, at 09:00 AM IST and conclude on Sunday, September 20, 2026, at 05:00 PM IST.
During the AGM, the company will seek approval for its Audited Financial Statements for FY 2025-26. It will also confirm the interim dividend of ₹2 per share and declare a final dividend of ₹3 per share, totaling ₹5 per share for FY 2025-26. Furthermore, the company proposes to issue bonus equity shares in the ratio of 1:1. The AGM will also address the re-appointment of Mr. A. Subramanyam as a Director and consider approvals for the remuneration of Mr. J. Lakshmana Rao (Chairman and Managing Director) and Mr. Subramanyam Adivishnu (Technical Director).
A plain-language summary of a public exchange filing by Mold-Tek Packaging Limited. Read the original for the full detail.