Paras Defence Subsidiary Signs MoU for ₹6,200 Crore IC Packaging Facility in MP
Paras Defence subsidiary, Paras Semiconductors, signed an MoU with MPSeDC to establish an advanced IC packaging OSAT facility in Madhya Pradesh. The proposed investment for this greenfield facility is approximately ₹6,200 Crores.
The establishment of a large-scale semiconductor packaging facility represents a major expansion into a high-growth sector, indicating a substantial impact on the company's future business and revenue.
The announcement details a significant investment and strategic partnership for establishing a new advanced semiconductor packaging facility, which is positive for the company's growth prospects.
Paras Defence and Space Technologies Limited announced that its subsidiary, Paras Semiconductors Private Limited, has signed a Memorandum of Understanding (MoU) with the Department of Science and Technology, acting through MP State Electronics Development Corporation (MPSeDC).
The collaboration aims to establish a greenfield advanced IC packaging OSAT (Outsourced Semiconductor Assembly and Test) facility in Madhya Pradesh. This facility, proposed to be located in Indore-Ujjain, will involve an investment of approximately ₹6,200 Crores.
The advanced packaging operations will include 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing, and reliability.
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Paras Defence and Space Technologies Limited filed this with the NSE as a statutory disclosure, categorised under strategic partnerships. It is a primary document, not a recommendation, and the desk marks it high impact, which is the band that most often changes something.
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See the model portfoliosA plain-language summary of a public exchange filing by Paras Defence and Space Technologies Limited. Read the original for the full detail.