TCS Unveils Chiplet-Based Engineering Services to Accelerate Semiconductor Innovation
The new services address a foundational technology critical for digital innovation and align with India's strategic goal of becoming a global semiconductor hub, potentially opening up substantial new revenue streams and strengthening TCS's market position in a high-growth industry.
The announcement details the launch of new, advanced engineering services by TCS in the rapidly growing and strategically important semiconductor sector, positioning the company to capitalize on significant market demand and national initiatives.
* Tata Consultancy Services (TCS) has launched its Chiplet-based System Engineering Services, aimed at helping semiconductor companies design faster, more efficient, and powerful next-generation chips using chiplets. * This initiative supports India's ambition to become a global semiconductor hub, aligning with the country's semiconductor market growth, which is projected to more than double from $45–50 billion in 2024-2025 to $100–110 billion by 2030, backed by the ₹76,000 crore India Semiconductor Mission. * The semiconductor industry is transitioning to chiplet-based designs to overcome scaling challenges, accelerate product launches, and reduce costs, driven by high demand from AI, cloud computing, smartphones, and electric vehicles. * V Rajanna, President, Technology, Software and Services, TCS, stated that these services will enable semiconductor enterprises to accelerate chiplets tapeout, ensuring flexibility, scalability, and faster time to market, leveraging TCS's extensive investments and industry expertise. * TCS offers comprehensive design and verification of industry standards like UCIe™ and HBM, alongside advanced package design services, including 2.5D and 3D interposers and multi-layer organic substrates. * These services are designed to empower clients to deliver next-generation multi-chip products with superior signal integrity, lower latency, and a compact form factor.
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